Advanced Prototype Packaging Facility (APPF)

Project Member(s): Langford, N., Williams, D., Iacopi, F.

Funding or Partner Organisation: Investment NSW (Tech Central Research and Innovation Infrastructure Fund)
Investment NSW (Tech Central Research and Innovation Infrastructure Fund)

Start year: 2023

Summary: This proposal aims to create a nationally unique Advanced Prototype Packaging Facility (APPF) across two locations (UTS and USYD) in the heart of Tech Central, for developing commercial grade device prototypes at low volumes. Our proposal is to house the main part of this facility at UTS in a state-of-the-art open-access cleanroom facility. A smaller selection of specific tools would be installed in USYD’s Research and Prototype Foundry (RPF). The proposed APPF offers transformative advanced packaging capabilities as a key opportunity to capture significantly increased economic benefit for Australia in advanced manufacturing industries.

FOR Codes: Quantum technologies, Communications engineering, Satellite, space vehicle and missile design and testing, Medical devices, Control engineering, mechatronics and robotics, Electronics, sensors and digital hardware, Nanotechnology, Microtechnology, Agriculture, land and farm management, Emerging defence technologies, ENERGY, ENVIRONMENTAL MANAGEMENT, Clinical health, Communication technologies, systems and services, Instrumentation, Expanding knowledge in engineering, Expanding knowledge in the physical sciences

Acknowledgement of Country

UTS acknowledges the Gadigal people of the Eora Nation, the Boorooberongal people of the Dharug Nation, the Bidiagal people and the Gamaygal people, upon whose ancestral lands our university stands. We would also like to pay respect to the Elders both past and present, acknowledging them as the traditional custodians of knowledge for these lands.